Title:
【発明の名称】携帯用基体、特にカード・フォーマット基体上に被覆層を製造する方法、及びかかる被覆層を備えた携帯用基体
Document Type and Number:
Japanese Patent JP2000504446
Kind Code:
A
Abstract:
The invention relates to a process for fabricating a coating layer (8) and a portable support (1) provided with such layer, comprising a support body (3) provided on one of its sides (4) with said coating layer (8). The process of the invention is characterized in that, for the fabrication of the coating layer (8), a transient thermoplastic layer (17) is cross-linked so as to make it thermosettable. The invention applies particularly to the fabrication of chip based cards.
Inventors:
Corniglion, Isabel
Le Richet, Christian
Le Richet, Christian
Application Number:
JP52490197A
Publication Date:
April 11, 2000
Filing Date:
December 30, 1996
Export Citation:
Assignee:
Jump Russe A.
International Classes:
G06K19/077; G06K19/02; G06K19/18; (IPC1-7): G06K19/02
Attorney, Agent or Firm:
Takashi Ishida (4 others)