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Title:
スパッタリングターゲットとそれを用いたＣｕ膜および電子デバイス
Document Type and Number:
Japanese Patent JP2001342560
Kind Code:
A5
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Application Number:
JP2000163759
Publication Date:
May 24, 2007
Export Citation:
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International Classes:
C23C14/34; H01L21/203; H01L21/285; C22C9/00



 
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