Title:
【発明の名称】アンダーフィル密封材として有用な熱硬化性樹脂組成物
Document Type and Number:
Japanese Patent JP2001506313
Kind Code:
A
Abstract:
The present invention provides a thermosetting resin composition useful as an underfilling sealant composition which rapidly fills the underfill space in a semiconductor device, such as a flip chip assembly which includes a semiconductor chip mounted on a carrier substrate, enables the semi-conductor to be securely connected to a circuit board by short-time heat curing and with good productivity, and demonstrates acceptable heat shock properties (or thermal cycle properties). The thermosetting resin composition which is used as an underfilling sealant between such a semiconductor device and a circuit board to which the semiconductor device is electrically connected, includes an epoxy resin component and a latent hardener component. The latent hardener component includes a cyanate ester component and an imidizole component.
Inventors:
Konarski, Mark
Schiapuniak, Zivignu, A.
Schiapuniak, Zivignu, A.
Application Number:
JP51020999A
Publication Date:
May 15, 2001
Filing Date:
July 22, 1998
Export Citation:
Assignee:
Loctite Corporation
International Classes:
C09K3/10; C08G59/40; C08G59/68; C08L63/00; H01L21/56; H01L23/02; H01L23/29; H01L23/31; (IPC1-7): C08G59/40; H01L21/56; H01L23/29
Attorney, Agent or Firm:
Nobuyuki Kaneda (2 others)