Title:
【発明の名称】重合性フラックス剤と当該フラックス剤を用いたフラックス性接着剤組成物
Document Type and Number:
Japanese Patent JP2001510205
Kind Code:
A
Abstract:
A thermally curable adhesive composition that includes a fluxing agent that also acts as an adhesive is provided. The composition includes: (a) a fluxing agent represented by the formula RCOOH, wherein R comprises a moiety having two or more carbon-carbon double bonds wherein in one embodiment, at least one is within an acrylate or methacrylate group, and which may further contain at least one aromatic moiety; (b) a carboxylic acid neutralizing agent; (c) optionally, a crosslinkable diluent; (d) optionally, a source of free radical initiators; and (e) optionally, a resin. The composition can be applied directly onto the surface(s) of devices that are to be joined electrically and mechanically. These devices include, printed circuit substrates, connectors, components, cables, and other electrical devices having metallization patterns to be soldered together by means of a solder-bumped pattern on one or both surfaces. Alternatively, a solder paste, comprising solder powder mixed with the fluxing agent of the present invention can be used. During the reflow step, the fluxing agent promotes wetting of the solder to the metallization patterns and, simultaneously, the fluxing agent itself crosslinks to mechanically bond and encapsulate the surfaces and their metallizations. The compositions can also be used to formulate sinterable conductive ink.
Inventors:
Albert Capote M
Liquidity
Xiao Chi
Zimin Zou
Liquidity
Xiao Chi
Zimin Zou
Application Number:
JP2000502881A
Publication Date:
July 31, 2001
Filing Date:
July 21, 1998
Export Citation:
Assignee:
Aguila Technologies, Inc.
International Classes:
B23K35/34; B23K35/02; B23K35/36; B32B7/12; C08G59/40; C09D11/10; C09J4/00; C09J4/02; H01B1/02; H01B1/06; H01L21/60; H01L23/29; H01L23/31; H01L23/498; H05K1/09; H05K3/32; (IPC1-7): C09J4/02; B23K35/34; C08G59/40; C09D11/10; H01B1/02; H01B1/06; H01L21/60; H01L23/29; H01L23/31
Attorney, Agent or Firm:
Akihide Sugimura (2 outside)