Title:
【発明の名称】表面処理
Document Type and Number:
Japanese Patent JP2002511907
Kind Code:
A
Abstract:
A method of treating a substrate comprises contacting a surface of said substrate, with a pressurized fluid comprising carbon dioxide and a surface treatment component, the surface treatment component being entrained in the pressurized fluid and contacting the surface so that the surface treatment component lowers the surface tension of the surface of the substrate and treats the substrate. The contacting step is preferably carried out by immersion, the fluid is preferably a liquid or supercritical fluid, the substrate is preferably a metal or fabric substrate, and the surface treatment component is preferably a fluoroacrylate polymer.
Inventors:
McBrain, James Bee
Romak, timothy
Romak, timothy
Application Number:
JP50091699A
Publication Date:
April 16, 2002
Filing Date:
May 29, 1998
Export Citation:
Assignee:
Maisel Technologies
International Classes:
B08B17/02; B05D1/18; C23C26/00; C23C30/00; D06M15/277; D06M15/643; D06M23/06; D06M23/10; (IPC1-7): D06M15/277; B05D1/18; B08B17/02; D06M23/06
Attorney, Agent or Firm:
Nao Okuyama (3 others)