Title:
【発明の名称】インサートターゲットアセンブリとそれを製造する方法
Document Type and Number:
Japanese Patent JP2002531690
Kind Code:
A
Abstract:
Method of forming a two-piece hollow cathode sputter target assembly and the assembly formed thereby. The sputter target assembly includes an outer shell having a substantially cylindrical side wall and is composed of a relatively low purity metallic material. A sputtering insert includes a substantially cylindrical side wall and is concentrically received within, and bonded to, the outer shell. The sputtering insert is composed of a relatively high purity metallic material as used for depositing a thin layer or film onto a desired substrate.
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Inventors:
Holcomb, Melvin, Kay.
Burns, William, Yi.
Bardas, Stephen, Elle.
Burns, William, Yi.
Bardas, Stephen, Elle.
Application Number:
JP2000585023A
Publication Date:
September 24, 2002
Filing Date:
December 03, 1999
Export Citation:
Assignee:
Tosoh SMD, Inc.
International Classes:
B23K20/00; B23K20/02; C23C14/34; (IPC1-7): C23C14/34; B23K20/00
Attorney, Agent or Firm:
Shinji Kouji (1 person outside)