Title:
【発明の名称】成形部品を製造するために選択的レーザ溶解を行なうデバイス
Document Type and Number:
Japanese Patent JP2002540945
Kind Code:
A
Abstract:
The invention relates to a device for selective laser sintering for producing a moulded part. The inventive device comprises a process chamber (1) having a structural volume (7) for the moulded part (16). Said structural volume (7) is located underneath the floor area (4) of said process chamber. The inventive device also comprises a leveling device for distributing a material in powder form over an area of the floor area of the process chamber in the form of a layer of constant thickness. According to the invention, said leveling device comprises an element (21) which is moved over the floor area in order to distribute said material in powder form. The device further comprises a roller (22) which is embodied as a grinding device by which means the surface of the moulded part to be treated can be smoothed, the moulded part being located in the structural volume. The inventive device prevents wear and tear of the leveling device and ensures that a constant layer thickness is achieved in such a way that components can be produced with better accuracy and better surface quality.
Inventors:
Mainels, Wilhelm
Wissenbach, Conrad
Gassel, andres
Wissenbach, Conrad
Gassel, andres
Application Number:
JP2000583660A
Publication Date:
December 03, 2002
Filing Date:
November 16, 1999
Export Citation:
Assignee:
Fraunhofer-Gesellschaft Tour Fordung der Angevanden Forsung A. Fao.
International Classes:
B23K26/00; B22F1/00; B22F3/00; (IPC1-7): B23K26/00
Attorney, Agent or Firm:
Yasunori Otsuka (3 others)