Title:
【発明の名称】酸無水物基を含有するポリマーを基礎とする熱硬化性組成物
Document Type and Number:
Japanese Patent JP2002542309
Kind Code:
A
Abstract:
The present invention concerns thermosetting compositions consisting essentially of a mixture of : (A) a polymer containing acid anhydride groups, (B) a molecular sieve being partially loaded with at least one amine (C) a filler capable of releasing water upon heating at a temperature above the processing temperature of the mixture (A), (B) and (C). These compositions are particularly useful to make hot melts and sheathings of electrical cables.
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Inventors:
Arvent, thomas
Clown, Gian-Michel
Robert, Patrice
Clown, Gian-Michel
Robert, Patrice
Application Number:
JP2000599817A
Publication Date:
December 10, 2002
Filing Date:
February 04, 2000
Export Citation:
Assignee:
Attoina
International Classes:
C08K3/00; C08K3/22; C08K3/34; C08K5/17; C08K9/04; C08K13/06; C08L23/08; C08L57/10; C08L101/06; C09D5/25; C09D7/12; C09D123/08; C09D133/06; C08J5/00; C09D135/00; C09D201/06; C09J157/10; H01B7/00; H01B7/295; (IPC1-7): C08L101/06; C08J5/00; C08K3/00; C08K3/34; C08K5/17; C08L23/08; C09D7/12; C09D123/08; C09D133/06; C09D135/00; C09D201/06; H01B7/295
Attorney, Agent or Firm:
Yoshio Kawaguchi (5 outside)