Title:
【発明の名称】電気接触器、特に流体圧力を用いるウェーハレベルの接触器
Document Type and Number:
Japanese Patent JP2003507882
Kind Code:
A
Abstract:
A probe assembly comprises a flexible wiring substrate (633) including a plurality of electrical connections to a semiconductor tester; and a plurality of compliant, elongate probes (639) disposed on said substrate in a pattern corresponding to a pattern of test features on a semiconductor device (505) to be tested, wherein said wiring of said substrate interconnects ones of said probes with ones of said electrical connections to said semiconductor tester.
Inventors:
Elidridge, Benjamin
Application Number:
JP2001517181A
Publication Date:
February 25, 2003
Filing Date:
August 10, 2000
Export Citation:
Assignee:
Form Factor, Incorporated
International Classes:
G01R1/073; G01R31/02; G01R31/28; G01R31/30; H01L21/66; H01R12/24; G01R31/26; (IPC1-7): H01L21/66; G01R1/073; G01R31/02; G01R31/26; G01R31/28; G01R31/30; H01R12/28
Domestic Patent References:
| JPH0737945A | 1995-02-07 |
Attorney, Agent or Firm:
Kaoru Furuya (2 outside)