Title:
【発明の名称】サブストレートを加工する装置および当該装置を用いてサブストレートを加工する方法
Document Type and Number:
Japanese Patent JP2003517931
Kind Code:
A
Abstract:
When a laser beam is focussed onto a substrate for the purpose of substrate processing, the optical units such as beam expander, deflecting unit, and optical imaging device prescribe the range of depth of focus in which it is possible to work with a minimum spot size. The difficulty of boring thin holes, especially in thick substrates, is overcome with a second laser beam that is widened via a second beam expander and likewise focused onto the substrate via the deflecting unit and the optical imaging device. The position and the length of the second range of depth of focus can be varied by selecting the magnification of the second beam expander or by maladjustment. Thin holes can also be bored into thick substrates by using the two laser beams one after another.
Inventors:
Leo Higgins
Hans Jürgen Meyer
Eddie Rehrantz
Alex shriner
Udo Vigerman
Hans Jürgen Meyer
Eddie Rehrantz
Alex shriner
Udo Vigerman
Application Number:
JP2001541642A
Publication Date:
June 03, 2003
Filing Date:
November 21, 2000
Export Citation:
Assignee:
Siemens Aktiengesellschaft
International Classes:
B23K26/00; B23K26/06; B23K26/073; B23K26/38; H05K3/00; H05K3/02; (IPC1-7): B23K26/06; B23K26/00
Attorney, Agent or Firm:
Toshio Yano (3 outside)