Title:
【発明の名称】化学機械平坦化を行なうための装置
Document Type and Number:
Japanese Patent JP2003517936
Kind Code:
A
Abstract:
An apparatus for chemical-mechanical planarization (CMP) of semiconductor wafers that allows independent micro-control of each spindle for tailored CMP performance. The present invention provides, in one embodiment, a CMP tool that includes a stationary bridge that houses a rack and pinion assembly. The rack and pinion assembly is coupled to a plurality of motor assemblies each of which is coupled to rotate a spindle. Significantly, movements of the spindles across are individually and independently controlled by the rack and pinion assembly. An advantage of the present independent spindle motion design allows optimization of the CMP process for each spindle and enables more accurate prediction of the effect of translation on CMP performance. Independent rotation and downforce capability of the present invention provides additional flexibility in terms of tuning polish rates and uniformity. Another advantage of the present invention is that a more compact enclosure for wafer isolation can be achieved.
Inventors:
Summit, Sengupta
Charles, F. Drill
Charles, F. Drill
Application Number:
JP2001546432A
Publication Date:
June 03, 2003
Filing Date:
September 13, 2000
Export Citation:
Assignee:
Konin Krekka Philips Electronics NV
International Classes:
B24B27/00; B24B37/30; B24B37/34; B24B47/12; B24B55/06; H01L21/304; (IPC1-7): B24B37/04; H01L21/304
Attorney, Agent or Firm:
Kenji Yoshitake (4 others)