Title:
【発明の名称】銅塩および芳香族ハロゲン化合物により安定化されたポリアミド組成物
Document Type and Number:
Japanese Patent JP2003518142
Kind Code:
A
Abstract:
The invention relates to a stabilized polyamide compound characterized in that at least one copper salt and at least one halogen-containing organic compound are contained as stabilizers, wherein the halogen-containing organic compound is selected from the group consisting of: (a) aromatic compounds; (b) aliphatic phosphates and (c) paraffins, or the mixtures thereof, provided that the polyamide is not a 4.6 polyamide when the aromatic compound is a brominated styrol oligomer.
Inventors:
Tichukau, Claus
Application Number:
JP2000575936A
Publication Date:
June 03, 2003
Filing Date:
October 15, 1999
Export Citation:
Assignee:
El. Bruggemann Kahge
International Classes:
C08J3/20; C08K3/16; C08K3/24; C08K3/32; C08K5/02; C08K5/03; C08K5/098; C08K5/51; C08K5/521; C08K5/524; C08J3/22; C08K5/56; C08L77/00; C08L77/06; C08L91/06; C08L91/08; (IPC1-7): C08L77/00; C08J3/22; C08K3/16; C08K3/24; C08K3/32; C08K5/02; C08K5/098; C08K5/521; C08K5/524; C08L91/08
Attorney, Agent or Firm:
Kiyokazu