Title:
【発明の名称】基板を処理するための装置
Document Type and Number:
Japanese Patent JP2003524297
Kind Code:
A
Abstract:
The aim of the invention is to provide a simple and economical device for opening and closing separate suction openings (13, 14, 15) of a device (1) which is provided for treating substrates, especially semiconductor wafers, and which comprises a treatment reservoir (3). Said treatment reservoir is filled with a treatment fluid and is arranged in an essentially closed space that has at least two separate suction openings (13, 14, 15). To this end, a rotatable disc (17) is provided which covers up the suction opening while isolating it from the space and which comprises a through-opening (18). One of the suction openings (13, 14, 15) can be at least partially overlapped by said through-opening.
Inventors:
Wolfgang Marschner
Uwe Muller
Uwe Muller
Application Number:
JP2001547631A
Publication Date:
August 12, 2003
Filing Date:
December 02, 2000
Export Citation:
Assignee:
Steerg Micro-Tech Gezel Shaft Mitt Beschlenktel Haftung
International Classes:
F16K3/08; H01L21/304; H01L21/683; (IPC1-7): H01L21/304
Attorney, Agent or Firm:
Toshio Yano (4 outside)