集積回路をテスト及びパッケージングするためのシステム

Japanese Patent JP2004501517

A

Several embodiments of stress metal springs are disclosed, which typically comprise a plurality of stress metal layers that are established on a substrate, which are then controllably patterned and partially released from the substrate. An effective rotation angle is typically created in the formed stress metal springs, defining a looped spring structure. The formed springs provide high pitch compliant electrical contacts for a wide variety of interconnection systems, including chip scale semiconductor packages, high density interposer connectors, and probe contactors. Several embodiments of massively parallel interface integrated circuit test assemblies are also disclosed, comprising one or more substrates having stress metal spring contacts, to establish connections between one or more separated integrated circuits on a compliant wafer carrier.

Mock sammy
Jeong Fu Chun

JP2002504502A

January 15, 2004

June 20, 2001

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Nano Nexus Incorporated

G01R31/26; G01R1/067; G01R1/073; H01L21/66; H01L23/12; H01L23/31; H01L23/32; H01L23/48; H01L23/485; (IPC1-7): H01L21/66; G01R1/073; G01R31/26; H01L23/12; H01L23/32

JPH06181301A	1994-06-28
JPH08264622A	1996-10-11
JPH0964049A	1997-03-07
JP2003501819A	2003-01-14

WO2001080315A2	2001-10-25
US3842189A	1974-10-15

Minoru Nakamura
Fumiaki Otsuka
Sadao Kumakura
Shishido Kaichi
Hideto Takeuchi
Toshio Imajo
Nobuo Ogawa
Village shrine Atsuo
Takaki Nishijima
Atsushi Hakoda

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