Title:
銅浴および無光沢銅被膜の電着方法
Document Type and Number:
Japanese Patent JP2004511663
Kind Code:
A
Abstract:
In the production of printed circuit boards it is required that organic protective coatings adhere tightly on the copper surfaces. Accordingly, matt layers of copper are to be preferred over lustrous coatings. The bath in accordance with the invention serves to deposit matt layers of copper and has the additional advantageous property that the layers may also be deposited with sufficient coating thickness in very narrow bore holes at average cathode current density. For this purpose the bath contains at least one polyglycerin compound selected from the group comprising poly(1,2,3-propantriol), poly(2,3-epoxy-1-propanol) and derivatives thereof.
Inventors:
Ulcia Desmaizon Gonzalo
Cretchmer stephan
Zenge Gerd
Ross Thorsten
Küssner Thorsten
Cretchmer stephan
Zenge Gerd
Ross Thorsten
Küssner Thorsten
Application Number:
JP2002536120A
Publication Date:
April 15, 2004
Filing Date:
October 10, 2001
Export Citation:
Assignee:
Atotehi Deutschland Gesellschaft Mitt Beschlenktel Haftung
International Classes:
C25D3/38; C25D5/18; C25D7/00; (IPC1-7): C25D3/38; C25D5/18; C25D7/00
Attorney, Agent or Firm:
Fujita Akira
Takehisa Ito
Takehisa Ito