Title:
表面改質のための大気圧反応性原子プラズマ加工装置及び方法
Document Type and Number:
Japanese Patent JP2004518527
Kind Code:
A
Abstract:
Reactive atom plasma processing can be used to shape, polish, planarize and clean the surfaces of difficult materials with minimal subsurface damage. The apparatus and methods use a plasma torch, such as a conventional ICP torch. The workpiece and plasma torch are moved with respect to each other, whether by translating and/or rotating the workpiece, the plasma, or both. The plasma discharge from the torch can be used to shape, planarize, polish, and/or clean the surface of the workpiece, as well as to thin the workpiece. The processing may cause minimal or no damage to the workpiece underneath the surface, and may involve removing material from the surface of the workpiece.
Inventors:
Car Jeffrey W
Application Number:
JP2002562128A
Publication Date:
June 24, 2004
Filing Date:
January 29, 2002
Export Citation:
Assignee:
Rapt Industries Incorporated
International Classes:
B01J19/08; B08B7/00; B23K1/20; C03C15/00; C04B41/53; C04B41/91; C23C16/04; H01L21/00; H01L21/304; H01L21/3065; H05H1/24; H05H1/30; (IPC1-7): B01J19/08; B08B7/00; H01L21/304; H01L21/3065; H05H1/30
Attorney, Agent or Firm:
Minoru Nakamura
Fumiaki Otsuka
Sadao Kumakura
Shishido Kaichi
Toshio Imajo
Nobuo Ogawa
Village shrine Atsuo
Takaki Nishijima
Atsushi Hakoda
Fumiaki Otsuka
Sadao Kumakura
Shishido Kaichi
Toshio Imajo
Nobuo Ogawa
Village shrine Atsuo
Takaki Nishijima
Atsushi Hakoda
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