Title:
ホスホルアミドを含む難燃性樹脂組成物および製造法
Document Type and Number:
Japanese Patent JP2004537607
Kind Code:
A
Abstract:
The present invetion provides resin compositions comprising a thermoplastic resin and at least one phosphoramide having a glass transition point of at least about 0 DEG C, preferably of at least about 10 DEG C, and most preferably of at least about 20 DEG C, of the formula (I): wherein Q<1> is oxygen or sulfur; R<1> is an amine residue, and R<2> and R<3> are each independently an alkyloxy, alkylthio, aryloxy, or arylthio residue, or an aryloxy or arylthio residue containing at least one alkyl substitution; or an amine residue, said phosphoramide being substantially free of acidic, basic, or halide impurities, or their precursors. The present invention also relates to articles made from the resin compositions. The present invention also provides methods to make the resin compositions having improved heat properties and hydrolytic stability over compositions known in the art.
Inventors:
Falcon, Neil, Stephen
Campbell, John, Robert
Campbell, John, Robert
Application Number:
JP2000567618A
Publication Date:
December 16, 2004
Filing Date:
July 30, 1999
Export Citation:
Assignee:
GENERAL ELECTRIC COMPANY
International Classes:
C08K5/49; C08K5/5399; C08L51/04; C08L69/00; C08J5/00; C08L71/12; C08L101/00; H05K1/03; (IPC1-7): C08L101/00; C08J5/00; C08K5/49; C08K5/5399
Attorney, Agent or Firm:
Kenichi Matsumoto
Nobuyuki Kaneda
Katsuhiro Ito
Ishibashi Masayuki
Nobuyuki Kaneda
Katsuhiro Ito
Ishibashi Masayuki