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Patent Searching and Data


Title:
マニホルドを中央に配置し区域加熱機能を有するホットメルト接着剤システム
Document Type and Number:
Japanese Patent JP2005507768
Kind Code:
A
Abstract:
A dispensing unit (20) for a hot melt adhesive system (10) has a manifold (26) centrally located within the dispensing unit (20) to permit commonality between heated hoses (46) of substantially the same length used to supply adhesive guns (51) at either side of the dispensing unit (20). The dispensing unit (20) also includes a manifold (26) that is thermally isolated from the adhesive tank (22). The manifold (26) has a heater (56) that is independent of the tank heater (34) for more precise temperature control of adhesive flowing through the manifold (26). A pump (58) coupled to the manifold (26) is located external to the tank (22) and is heated by the manifold heater (56).

Inventors:
Jetter, David, Earl.
Andel, David, F.
Application Number:
JP2003539859A
Publication Date:
March 24, 2005
Filing Date:
October 23, 2002
Export Citation:
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Assignee:
NORDSON CORPORATION
International Classes:
B05C5/04; B05C11/10; (IPC1-7): B05C11/10
Attorney, Agent or Firm:
Masao Okabe
Nobuaki Kato
Kazuo
Shinichi Usui
Takao Ochi
Teruhisa Motomiya
Seiichiro Takahashi
Koji Yoshizawa
Takao Matsui