Title:
補強されたギア材料の表面または他の磨耗表面上に、樹脂に富む表皮を適用する方法。
Document Type and Number:
Japanese Patent JP2005512841
Kind Code:
A
Abstract:
This invention provides a method of applying a coating of a resin-rich material to a substrate to produce a molded device. The method involves installing a layer of the resin-rich material over a mold die and adding a molten substrate to melt the resin-rich layer and filling the mold. The mold is cooled and a molded device with a surface containing the resin-rich layer is formed.
Inventors:
Buchanan, Harry Sea Jr.
Application Number:
JP2003550959A
Publication Date:
May 12, 2005
Filing Date:
December 11, 2002
Export Citation:
Assignee:
Valeo Electrical Systems Incorporated
International Classes:
B29C37/00; B29C45/14; B29C41/00; B29C41/08; B29C45/00; B29K21/00; B29K59/00; B29K71/00; B29K77/00; B29L15/00; (IPC1-7): B29C45/14
Domestic Patent References:
| JPS6295209A | 1987-05-01 | |||
| JPH04119810A | 1992-04-21 | |||
| JPH03114719A | 1991-05-15 | |||
| JPS6135216A | 1986-02-19 | |||
| JPS61132317A | 1986-06-19 |
Attorney, Agent or Firm:
Takehiko Suzue
Satoshi Kono
Makoto Nakamura
Kurata Masatoshi
Yoshihiro Fukuhara
Sadao Muramatsu
Ryo Hashimoto
Satoshi Kono
Makoto Nakamura
Kurata Masatoshi
Yoshihiro Fukuhara
Sadao Muramatsu
Ryo Hashimoto