Title:
閉ループ欠陥低減のためのシステムと方法
Document Type and Number:
Japanese Patent JP2005516196
Kind Code:
A
Abstract:
Systems and methods for repairing defects on a specimen are provided. A method may include processing a specimen, detecting defects on the specimen, and repairing one or more of the defects. An additional method may include detecting defects on a specimen, repairing one or more of the defects, and inspecting the specimen to detect defects remaining on the specimen subsequent to repair. A system may include a process chamber, a measurement device configured to detect defects on a specimen, and a repair tool configured to repair one or more of the defects detected on the specimen. An additional system may include a measurement device, a repair tool, and an inspection tool configured to detect defects remaining on the specimen subsequent to repair. The systems may also include a processor configured to alter a parameter of an instrument coupled to the repair tool in response to output from the measurement device.
Inventors:
Marela, Paul
Application Number:
JP2003562995A
Publication Date:
June 02, 2005
Filing Date:
January 16, 2003
Export Citation:
Assignee:
KL Tencor Technologies Corporation
International Classes:
G01B21/30; G01N21/55; G01N21/956; G01N23/225; H01L21/66; (IPC1-7): G01N21/956; G01B21/30; G01N23/225; H01L21/66
Attorney, Agent or Firm:
Masaki Yamakawa
Shigeki Yamakawa
Shigeki Yamakawa
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