Title:
層状積層モデリングのための平滑化方法
Document Type and Number:
Japanese Patent JP2005523177
Kind Code:
A
Abstract:
Disclosed is a method for smoothing the surface of an object built from a polymeric or wax material using a layered manufacturing rapid prototyping technique. After the object is built it is exposed to a vaporized solvent such as in a vaporizer for an exposure time sufficient to reflow the object surface. A solvent is chosen based on its ability to transiently soften the material which forms the object, and thereafter evaporate off the object. The object is removed from the solvent and allowed to dry, producing a smooth finished part.
Inventors:
Smith, david thomas
Yang Yang
Yang Yang
Application Number:
JP2003585953A
Publication Date:
August 04, 2005
Filing Date:
April 04, 2003
Export Citation:
Assignee:
Stratasys, Inc.
International Classes:
B29C41/36; B29C41/02; B29C67/00; B29C71/00; B29C41/48; B29K91/00; (IPC1-7): B29C67/00
Domestic Patent References:
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| JPH04506044A | 1992-10-22 | |||
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Attorney, Agent or Firm:
Hidesaku Yamamoto
Takaaki Yasumura
Natsuki Morishita
Takaaki Yasumura
Natsuki Morishita