Title:
界面接着剤
Document Type and Number:
Japanese Patent JP2005531667
Kind Code:
A
Abstract:
The invention is directed thermal interfaced die assemblies and 1-component, 96-100% solids, thermosetting, silver-filled thermal interface based on epoxy resins useful for integrated circuit packages enabling conducting heat generated by the die. The adhesive is placed between the die and lid, lid and heat sink and/or die and the heat sink. The interface adhesive composition comprises an inorganic component and an organic component. The inorganic component comprising thermally conductive filler is present at from 70% 85% by weight, and organic component comprises from 60 to 70 wt. % of a diglycidal ether of a bis-phenol compound, 4 to 30 wt. % of an acyclic aliphatic or cycloaliphatic or mononuclear aromatic diglycidal ether, 3 to 30% of a monofunctional epoxy compound, and 20-30% of a polyamine anhydride adduct.
Inventors:
Wilson, Mark Bee
Hogan, James Etch
Owen, Michelle El
Hogan, James Etch
Owen, Michelle El
Application Number:
JP2004517711A
Publication Date:
October 20, 2005
Filing Date:
June 19, 2003
Export Citation:
Assignee:
Road corporation
International Classes:
C08G59/54; C08L63/00; C09J9/02; C09J11/04; C09J11/06; C09J163/00; C08K3/00; C09J163/02; H01L21/52; H01L23/373; C08K3/08; (IPC1-7): C09J163/02; C08K3/00; C08L63/00; C09J11/04; C09J11/06; H01L21/52; H01L23/373
Domestic Patent References:
| JPS63301283A | 1988-12-08 | |||
| JPH11228787A | 1999-08-24 | |||
| JPH11209716A | 1999-08-03 | |||
| JPS63301283A | 1988-12-08 | |||
| JPH11228787A | 1999-08-24 | |||
| JPH11209716A | 1999-08-03 |
Foreign References:
| US3488742A | 1970-01-06 | |||
| US3488742A | 1970-01-06 |
Attorney, Agent or Firm:
Warren G. Simor