Title:
小さなサイズの構成要素と大きなサイズの構成要素を組み込んでいる装置およびその作成方法
Document Type and Number:
Japanese Patent JP2006504251
Kind Code:
A
Abstract:
The present invention relates to the field of fabricating elements on a substrate. In one embodiment, the invention is an apparatus. The apparatus includes a strap having embedded therein an integrated circuit, the integrated circuit having a conductive pad. The apparatus also includes a conductive medium attached to the conductive pad of the integrated circuit. In an alternate embodiment, the invention is a method. The method includes attaching a conductive medium to a strap having embedded therein an integrated circuit such that the conductive medium is connected electrically to the integrated circuit. The method also includes attaching a large-scale component to the conductive medium such that the large-scale component is electrically connected to the conductive medium. The apparatus can also include a thin-film dielectric layer formed over a portion of the integrated circuit and a portion of the substrate.
Inventors:
Glengel, Glen Double
Hadley, Mark A
Eisenhart, Randolph W
Swindlehurst, Susan
Dorzaik, Paul Es
Vicentini, Frederick Jay
Hemingway, John Moon
Hadley, Mark A
Eisenhart, Randolph W
Swindlehurst, Susan
Dorzaik, Paul Es
Vicentini, Frederick Jay
Hemingway, John Moon
Application Number:
JP2003562978A
Publication Date:
February 02, 2006
Filing Date:
January 23, 2003
Export Citation:
Assignee:
Alien Technology Corporation
International Classes:
H01L21/60; G06K19/077; H01L23/498; H01L23/538
Attorney, Agent or Firm:
Masaki Yamakawa