Title:
低誘電性有機シリケートポリマー複合体
Document Type and Number:
Japanese Patent JP2006515644
Kind Code:
A
Abstract:
Provided are a porous organosilicate polymer composite prepared by heating an organic/inorganic hybrid polymer in which an organosilicate polymer is chemically bonded to a radial pore-forming polymer ended with a hydrolyzable alkoxysilyl group and used as a core molecule, and a semiconductor device using an organosilicate polymer composite film including the porous organosilicate polymer composite. The organosilicate polymer composite film has a very low dielectric constant, and thus, is useful as a dielectric film of the semiconductor device.
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Inventors:
Lee, Moon Har
Oh, Weonte
Wang, Yeon-Tech
Lee, Byung Do
Oh, Weonte
Wang, Yeon-Tech
Lee, Byung Do
Application Number:
JP2005518200A
Publication Date:
June 01, 2006
Filing Date:
August 20, 2004
Export Citation:
Assignee:
Postec Foundation
International Classes:
C08G65/32; C08G81/00; C08G77/42; H01L21/312; C08L83/10
Attorney, Agent or Firm:
Mikio Hatta
Yasuo Nara
Katsuyuki Utani
Ken Fujita
Masanori
Toshihiro Hasegawa
Yasuo Nara
Katsuyuki Utani
Ken Fujita
Masanori
Toshihiro Hasegawa