Title:
固定研磨材料の製造方法
Document Type and Number:
Japanese Patent JP2006519115
Kind Code:
A
Abstract:
Provided is a method for manufacturing a fixed abrasive material suitable for use in CMP planarization pads from an aqueous polymer dispersion that also includes abrasive particles that involves frothing the polymer dispersion, applying the froth to a substrate, mold or carrier and curing the froth to form a fixed abrasive material having an open cell structure containing between about 5 and 85 wt % abrasive particles and a dry density of about 350 kg/m3 to 1200 kg/m3.
Inventors:
Baliger Paris, Sudhakar
Aldrich, Dale Jay.
Grier, Roller.
Aldrich, Dale Jay.
Grier, Roller.
Application Number:
JP2006503709A
Publication Date:
August 24, 2006
Filing Date:
February 19, 2004
Export Citation:
Assignee:
Dow Global Technologies Incorporated
International Classes:
B24B37/00; B24D11/00; B24D3/00; B24D3/32; B24D13/14; B24D18/00; C09K3/14; C09K23/00; C09K23/10; C09K23/26; H01L21/304
Attorney, Agent or Firm:
Atsushi Aoki
Takashi Ishida
Tetsuji Koga
Masaya Nishiyama
Takashi Ishida
Tetsuji Koga
Masaya Nishiyama