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Patent Searching and Data


Title:
フェロキャパシタの組立プロセス
Document Type and Number:
Japanese Patent JP2006521687
Kind Code:
A
Abstract:
A process for the fabrication of a ferrocapacitor comprising depositing a first mask element 7 over a structure having a bottom electrode 1, a ferroelectric layer 3 and a top electrode 5. RIE etching is performed to remove portions of the top electrode 5 and the ferroelectric layer 3. Then a second hard mask element 9 is deposited over the first hardmask element. The second hard mask element is rounded by an etch back process, and its taper angle is controlled to be in the range 75-87°. A second RIE etching process is performed to remove portions of the bottom electrode 1. Due to the rounding of the second hard mask elements 9 low residues are formed on the sides of the etched bottom electrode 1.

Inventors:
Juan Haoren
Ulrich Egger
Kazuhiro Tomioka
Application Number:
JP2005518790A
Publication Date:
September 21, 2006
Filing Date:
March 30, 2004
Export Citation:
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Assignee:
Infineon Technologies AG
Toshiba Corporation
International Classes:
H01L27/105; H01L21/02; H01L21/3065; H01L21/3213; H01L21/8246
Attorney, Agent or Firm:
Osamu Kawamiya
Masahiro Ishino
Kazuhisa Inaba