Title:
剥離可能な粘着剤組成物
Document Type and Number:
Japanese Patent JP2006524719
Kind Code:
A
Abstract:
The present invention provides an adhesive composition comprising an adhesive polymer resin and an organic crystalline material having a higher melting point than the maximum acceptable operating temperature of products where the adhesive is used, as well as an adhesive sheet prepared therefrom. The adhesive composition and adhesive sheet of the present invention maintain excellent adhesion strength at their use temperature and show a rapid reduction in adhesion at a higher temperature than the melting point of the organic crystalline material so as to allow release from substrates.
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Inventors:
Jean-Sung Kim
Woo-ha kim
Jae Guan Yi
School-Ki Chang
Uk Kim
Gyun-Hee Lee
Byung-su Lee
Woo-ha kim
Jae Guan Yi
School-Ki Chang
Uk Kim
Gyun-Hee Lee
Byung-su Lee
Application Number:
JP2006500718A
Publication Date:
November 02, 2006
Filing Date:
January 26, 2005
Export Citation:
Assignee:
LG HAUSYS,LTD.
International Classes:
C09J133/10; B05D7/24; C09J201/00; C08G63/02; C09J7/00; C09J7/02; C09J11/00; C09J11/06; C09J133/00; C09J133/02; C09J133/04; C09J133/12
Domestic Patent References:
| JP2002338934A | 2002-11-27 | |||
| JP2003105299A | 2003-04-09 | |||
| JP2003226851A | 2003-08-15 | |||
| JP2002338906A | 2002-11-27 | |||
| JP2001303019A | 2001-10-31 |
Foreign References:
| WO2002050209A1 | 2002-06-27 |
Attorney, Agent or Firm:
Masatake Shiga
Shinya Mitsuhiro
Shinya Mitsuhiro