Title:
渦巻状に巻かれた回路デバイスおよびその製造方法
Document Type and Number:
Japanese Patent JP2006527484
Kind Code:
A
Abstract:
A coiled circuit device is produced by forming a circuit layer on a substrate. Optional insulator layers may be disposed above and below the circuit layer. The circuit layer, which may be memory, control, or other circuitry, is released from the substrate such that it coils into a dense, coiled device. A stressed coiling layer may be included which effects coiling when the circuit layer is released.
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Inventors:
Nathanson, Harvey
Howell, Robert Es
Strasca, Garrett Ay
Howell, Robert Es
Strasca, Garrett Ay
Application Number:
JP2006515245A
Publication Date:
November 30, 2006
Filing Date:
June 07, 2004
Export Citation:
Assignee:
Northrop Grumman Corporation
International Classes:
H01L27/12; H01L21/8244; H01L21/84; H01L25/04; H01L25/18; H01L27/10; H01L27/11; H01L29/786
Attorney, Agent or Firm:
Kuro Fukami
Toshio Morita
Yoshihei Nakamura
Yutaka Horii
Hisato Noda
Masayuki Sakai
Toshio Morita
Yoshihei Nakamura
Yutaka Horii
Hisato Noda
Masayuki Sakai