Title:
MEMSベースの多極静電チャック
Document Type and Number:
Japanese Patent JP2007503123
Kind Code:
A
Abstract:
The present invention is directed to a semiconductor processing apparatus and a method for clamping a semiconductor substrate and controlling a heat transfer associated therewith. According to one aspect of the present invention, a multi-polar electrostatic chuck and associated method is disclosed which provides a controlled and uniform heat transfer coefficient across a surface thereof. The multi-polar electrostatic chuck comprises a semiconductor platform having a plurality of protrusions that define gaps therebetween, wherein a distance or depth of the gaps is uniform and associated with a mean free path of the cooling gas therein. The electrostatic chuck is permits a control of a backside pressure of a cooling gas within the plurality of gaps to thus control a heat transfer coefficient of the cooling gas. The plurality of protrusions further provide a uniform contact surface, wherein a contact conductivity between the plurality of protrusions and the substrate is controllable and significantly uniform across the substrate.
Inventors:
Kellerman Peter
Quinn shoe
Brown douglas
Quinn shoe
Brown douglas
Application Number:
JP2006524032A
Publication Date:
February 15, 2007
Filing Date:
August 18, 2004
Export Citation:
Assignee:
Axcelis Technologies, Inc.
International Classes:
H01L21/683
Domestic Patent References:
| JP2000332091A | 2000-11-30 | |||
| JP2001345372A | 2001-12-14 |
Attorney, Agent or Firm:
Calyx
Miyazaki Yoshio
Mitsuo Tateishi
Kaoru Onozuka
Akio Tagami
High Masahiro
Toshio Nakamura
Tsutomu Kato
Yusuke Murakoshi
Miyazaki Yoshio
Mitsuo Tateishi
Kaoru Onozuka
Akio Tagami
High Masahiro
Toshio Nakamura
Tsutomu Kato
Yusuke Murakoshi