Title:
熱膨張係数が低くハンダボール溶融性能に優れるノンフローアンダーフィル材
Document Type and Number:
Japanese Patent JP2007504336
Kind Code:
A
Abstract:
A no-flow underfill composition comprising an epoxy resin in combination with epoxy hardener and optional reagents and a filler of a functionalized colloidal silica having a particle size ranging from about 1 nm to about 250 nm. The colloidal silica is functionalized with at least one organoalkoxysilane functionalization agent and subsequently functionalized with at least one capping agent. The epoxy hardener includes anhydride curing agents. The optional reagents include cure catalyst and hydroxyl-containing monomer. The adhesion promoters, flame retardants and defoaming agents may also be added to the composition. Further embodiments of the present disclosure include packaged solid state devices comprising the underfill compositions.
Inventors:
Rubinstein, Slowmere
Snappy, sandeep
John Campbell
Prava Kumar, Anance
Snappy, sandeep
John Campbell
Prava Kumar, Anance
Application Number:
JP2006526161A
Publication Date:
March 01, 2007
Filing Date:
September 01, 2004
Export Citation:
Assignee:
GENERAL ELECTRIC COMPANY
International Classes:
C08L63/00; C08K9/06; H01L21/56; H01L23/29; H01L23/31
Domestic Patent References:
| JP2006507395A | 2006-03-02 | |||
| JP2006507210A | 2006-03-02 | |||
| JP2003105168A | 2003-04-09 | |||
| JP2003518187A | 2003-06-03 | |||
| JPS641771A | 1989-01-06 | |||
| JPH0314862A | 1991-01-23 | |||
| JP2002179885A | 2002-06-26 | |||
| JPH0797477A | 1995-04-11 | |||
| JP2005036069A | 2005-02-10 | |||
| JP2005105243A | 2005-04-21 |
Foreign References:
| US6180696B1 | 2001-01-30 |
Attorney, Agent or Firm:
Kenichi Matsumoto
Hirokazu Ogura
Toshihisa Kurokawa
Hirokazu Ogura
Toshihisa Kurokawa