Title:
マイクロ構造デバイス及びその製造方法
Document Type and Number:
Japanese Patent JP2007505747
Kind Code:
A
Abstract:
An embossing master ( 20 ) is produced by successively applying epoxy layers ( 2, 10 ) over a silicon substrate ( 1 ) and selectively exposing them to UV to cross-link according to a pattern. Non-exposed epoxy is developed away to leave a pattern of cured epoxy at each level. This provides a multi-level master, with a desired 3D configuration. The master ( 20 ) is then used to emboss a polymer blank to provide a substrate ( 80 ) and a different master is used to emboss a blank to provide a superstrate ( 90 ). The substrate ( 80 ) has aligned socket and channel grooves ( 80, 81 ) and the superstrate ( 90 ) has a socket groove ( 91 ). When the superstrate is mated with the substrate, there is a socket for receiving a fluidic capillary or a detection waveguide. The capillary or waveguide is aligned with the channel for optimum fluidic flow or optical detection.
Inventors:
O'Brien, Peter
Kruger, Yang
Redmond, Gareth
Kruger, Yang
Redmond, Gareth
Application Number:
JP2006526805A
Publication Date:
March 15, 2007
Filing Date:
September 17, 2004
Export Citation:
Assignee:
Nanocoms Patents Limited
International Classes:
B81C99/00; B01J19/00; B01L3/00; B81B1/00; B81B7/02; B81C1/00; B81C3/00; G02B6/138; G02B6/30; G02B6/42
Foreign References:
| US6447661B1 | 2002-09-10 | |||
| WO2002072189A2 | 2002-09-19 | |||
| WO2003065088A2 | 2003-08-07 |
Attorney, Agent or Firm:
Akihiko Umeda