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Patent Searching and Data


Title:
化学的機械的研磨用の研磨パッド
Document Type and Number:
Japanese Patent JP2007505749
Kind Code:
A
Abstract:
The present invention provides in one embodiment, a polishing pad 100 for chemical mechanical polishing. The polishing pad comprises a polishing body 110. The polishing body comprises a thermoplastic foam substrate 115 having a surface 120 comprising concave cells 125. A polishing agent 130 coats an interior surface 135 of the concave cells. The polishing agent comprises an inorganic metal oxide that includes carbides or nitrides. Yet another embodiment of the present invention is a method for preparing a polishing pad 200.

Inventors:
オベング,ヨー,エス.
Application Number:
JP2006526974A
Publication Date:
March 15, 2007
Filing Date:
September 14, 2004
Export Citation:
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Assignee:
サイロクエスト インコーポレーテッド
International Classes:
B24D3/00; B24B37/00; B24B37/04; B24D3/26; B24D3/34; B24D13/14
Attorney, Agent or Firm:
岡部 正夫
加藤 伸晃
岡部 讓
臼井 伸一
越智 隆夫
本宮 照久
朝日 伸光
三山 勝巳