Title:
電子ビームエンハンスト大面積堆積システム
Document Type and Number:
Japanese Patent JP2007507602
Kind Code:
A
Abstract:
This invention provides a means to deposit thin films and coatings on a substrate using an electron beam generated plasma. The plasma can be used as an ion source in sputter applications, where the ions are used to liberate material from a target surface which can then condense on a substrate to form the film or coating. Alternatively, the plasma may be combined with existing deposition sources including those based on sputter or evaporation techniques. In either configuration, the plasma serves as a source of ion and radical species at the growing film surface in reactive deposition processes. The electron beam large area deposition system (EBELADS) is a new approach to the production of thin films or coatings up to and including several square meters.
Inventors:
Walton, Scott, Gee
Leonhard, Darling
Major, robert, a
Fernsler, richard
Murrate, Christopher
Leonhard, Darling
Major, robert, a
Fernsler, richard
Murrate, Christopher
Application Number:
JP2006523827A
Publication Date:
March 29, 2007
Filing Date:
May 13, 2004
Export Citation:
Assignee:
THE UNITED STATES OF AMERICA
International Classes:
C23C14/34; C23C14/32; H01L
Domestic Patent References:
| JPH09111443A | 1997-04-28 |
Foreign References:
| US3393142A | 1968-07-16 | |||
| US3436332A | 1969-04-01 |
Attorney, Agent or Firm:
Takao Hamano
Morita Tetsuji
Teruichi Hirai
Morita Tetsuji
Teruichi Hirai