Title:
高密度熱負荷のための冷却システム
Document Type and Number:
Japanese Patent JP2007514121
Kind Code:
A
Abstract:
A cooling system for transferring heat from a heat load to an environment has a volatile working fluid. The cooling system includes first and second cooling cycles that are thermally connected to the first cooling cycle. The first cooling cycle is not a vapour compression cycle and includes a pump, an air-to-fluid heat exchanger, and a fluid-to-fluid heat exchanger. The second cooling cycle can include a chilled water system for transferring heat from the fluid-to-fluid heat exchanger to the environment. Alternatively, the second cooling system can include a vapor compression system for transferring heat from the fluid-to-fluid heat exchanger to the environment.
Inventors:
Bowroll, Stephen A
Franklin Yee, Day Paolo
Harvey, Thomas Yee
Madara, Stephen M
Mom, Rare Say Jay
Shirato, Stephen Sea
Franklin Yee, Day Paolo
Harvey, Thomas Yee
Madara, Stephen M
Mom, Rare Say Jay
Shirato, Stephen Sea
Application Number:
JP2006542755A
Publication Date:
May 31, 2007
Filing Date:
December 02, 2004
Export Citation:
Assignee:
Libert Corporation
International Classes:
F28D15/02; F25B1/00; F25B23/00; F25B25/00; F25D17/00
Domestic Patent References:
| JP2002243218A | 2002-08-28 | |||
| JP2002303476A | 2002-10-18 | |||
| JP2003065618A | 2003-03-05 |
Attorney, Agent or Firm:
Yoshio Kawaguchi
Makoto Ono
Chihiro Watanabe
Kenkyo Kanayama
Katsuma Osaki
Mitsuaki Tsubokura
Makoto Ono
Chihiro Watanabe
Kenkyo Kanayama
Katsuma Osaki
Mitsuaki Tsubokura