Title:
接着力の向上した新規アンダーフィル材料
Document Type and Number:
Japanese Patent JP2007516331
Kind Code:
A
Abstract:
An underfill composition with enhanced adhesion and improved resistance to cracking comprising an epoxy resin in combination with a difunctional siloxane anhydride epoxy hardener and optional reagents. In some embodiments, the epoxy resin includes a functionalized colloidal silica filler having a particle size ranging from about 1 nm to about 500 nm. The difunctional siloxane anhydride epoxy hardener can optionally be combined with liquid anhydride epoxy hardeners. Cure catalysts, hydroxyl-containing monomers, adhesion promoters, flame retardants and defoaming agents may also be added to the composition. Further embodiments of the present disclosure include packaged solid state devices comprising the underfill compositions.
Inventors:
Rubinstein, Slawomir
John Campbell
Prava Kumar, Anance
Tonapi, Sandeep Shrikant
John Campbell
Prava Kumar, Anance
Tonapi, Sandeep Shrikant
Application Number:
JP2006545646A
Publication Date:
June 21, 2007
Filing Date:
November 15, 2004
Export Citation:
Assignee:
GENERAL ELECTRIC COMPANY
International Classes:
C08G59/42; C08G77/14; C08G77/38; H01L23/29; H01L23/31
Domestic Patent References:
| JPH06157551A | 1994-06-03 | |||
| JPH0356490A | 1991-03-12 | |||
| JPH0379624A | 1991-04-04 |
Foreign References:
| WO2003101164A1 | 2003-12-04 |
Attorney, Agent or Firm:
Kenichi Matsumoto
Hirokazu Ogura
Toshihisa Kurokawa
Arakawa Satoshi
Hirokazu Ogura
Toshihisa Kurokawa
Arakawa Satoshi