Title:
電気化学機械的処理のための方法および装置
Document Type and Number:
Japanese Patent JP2007528794
Kind Code:
A
Abstract:
The invention provides a cell, a system and an article for processing a substrate in an electrochemical mechanical polishing system. A cell for polishing a substrate includes a polishing pad disposed on a top surface of a platen assembly. A plurality of conductive elements are arranged in a spaced-apart relation across the upper polishing surface and adapted to bias the substrate relative to an electrode disposed between the pad and the platen assembly. A plurality of passages are formed through the platen assembly between the top surface and a plenum defined within the platen assembly. A system is provided having a bulk polishing cell and a residual polishing cell. The residual polishing cell includes a biased conductive polishing surface. In further embodiments, the conductive element is protected from attack by process chemistries.
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Inventors:
One, Yang
Neo, Shoe, S.
Liu, Feng, Cue.
Tsai, Stan, Dee.
F, Yonki
Deboost, Alan
Mannes, Antony, Pea.
Waddens Wailer, Ralph, M.
Mavlive, Rashid
Chen, Liang-yu
Olgado, Donald, Jay. Kay.
Butterfield, Paul, Dee.
Tsuen, Min-Quay
Chang, Shu-San
San, Lizhon
Neo, Shoe, S.
Liu, Feng, Cue.
Tsai, Stan, Dee.
F, Yonki
Deboost, Alan
Mannes, Antony, Pea.
Waddens Wailer, Ralph, M.
Mavlive, Rashid
Chen, Liang-yu
Olgado, Donald, Jay. Kay.
Butterfield, Paul, Dee.
Tsuen, Min-Quay
Chang, Shu-San
San, Lizhon
Application Number:
JP2006518987A
Publication Date:
October 18, 2007
Filing Date:
July 01, 2004
Export Citation:
Assignee:
APPLIED MATERIALS,INCORPORATED
International Classes:
B23H5/08; B24B37/04; B24B53/007; C25F7/00; H01L21/304; H01L21/321
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yuichi Yamada
Yuichi Yamada