Title:
粉末によってまたは混合粉末によってモールドを充填するためのデバイス
Document Type and Number:
Japanese Patent JP2007533486
Kind Code:
A
Abstract:
A device for filling at least one mold with at least one powder. The device includes a mechanism to add at least one powder, at least one mechanism to eject the powder added into the device, in the form of a layer, and at least one deflector capable of locally intercepting at least part of the powder ejected in the form of a layer and redirecting the locally intercepted powder towards a determined location in the mold.
Inventors:
Stefan Revol
Application Number:
JP2006540563A
Publication Date:
November 22, 2007
Filing Date:
November 25, 2004
Export Citation:
Assignee:
COMPAGNIE GENERALE DES MATIERES NUCLEAIRES
Federal Mogul Operation France S.A.S.
Federal Mogul Operation France S.A.S.
International Classes:
B28B3/02; B22F3/00; B22F3/035; B28B13/02; B30B15/30
Domestic Patent References:
JP2000119704A | 2000-04-25 | |||
JP2000119704A | 2000-04-25 |
Foreign References:
DE2450736B1 | 1976-02-05 | |||
FR2234045A1 | 1975-01-17 | |||
DE2450736B1 | 1976-02-05 | |||
FR2234045A1 | 1975-01-17 |
Attorney, Agent or Firm:
Masatake Shiga
Takashi Watanabe
Yasuhiko Murayama
Shinya Mitsuhiro
Takashi Watanabe
Yasuhiko Murayama
Shinya Mitsuhiro