Title:
高屈折率を有する感光性樹脂組成物
Document Type and Number:
Japanese Patent JP2008502938
Kind Code:
A
Abstract:
The present invention discloses a photosensitive resin composition which comprises (A) a compound having a molecule with at least one thiirane ring and a total number of a thiirane ring and/or an epoxy ring of at least 2 in the molecule, and (B) a photo acid generator, said composition having a refractive index of at least 1.6, and a method of obtaining a high refractive index periodical structure which comprises subjecting the photosensitive resin composition to photolithography.
Inventors:
Over, Christopher Kay
Taiji Murakami
Taiji Murakami
Application Number:
JP2007516445A
Publication Date:
January 31, 2008
Filing Date:
June 17, 2004
Export Citation:
Assignee:
CORNELL RESEARCH FOUNDATION, INCORPORATED
International Classes:
G03F7/038; C08G75/08; G02B1/04; G03F7/004; G03F7/029
Domestic Patent References:
| JPH11106606A | 1999-04-20 | |||
| JPH1160683A | 1999-03-02 |
Attorney, Agent or Firm:
Hajime Tsukuni
Koshiro Tsukuda
Fusayuki Saito
Koshiro Tsukuda
Fusayuki Saito