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Title:
はんだ合金
Document Type and Number:
Japanese Patent JP2008521619
Kind Code:
A
Abstract:
An alloy suitable for use in a wave solder process, hot air levelling process, a ball grid array or chip scale package comprising no more than 3 wt.% bismuth, from 0.15-1.5 wt.% copper, from 0.1-1.5 wt.% silver, and the balance tin, with optionally other alloying elements in certain embodiments, together with unavoidable impurities.

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Inventors:
Ingham, Anthony
Campbell, gerald
Lewis, Brian
Thing, Bawa
Lauren, john
Panda, Ranjit
Application Number:
JP2007543916A
Publication Date:
June 26, 2008
Filing Date:
December 01, 2005
Export Citation:
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Assignee:
Alpha Fly Limited
International Classes:
B23K35/26; C22C13/00; C22C13/02
Domestic Patent References:
JP2006524572A2006-11-02
JP2003001482A2003-01-08
JPH1034376A1998-02-10
JP2000280090A2000-10-10
Foreign References:
WO2004096484A22004-11-11
Attorney, Agent or Firm:
Yuichi Yamada
Masakazu Noda



 
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