Title:
シリコン包装材材料
Document Type and Number:
Japanese Patent JP2009502669
Kind Code:
A
Abstract:
The present invention relates to a method of packaging a packageable product comprising the step of placing the packageable product and a silicon material within a package. The packageable product may be a food or a drink. The silicon material may comprise porous silicon, for example it may comprise films or particles of vivid colour. The silicon material may be used to absorb substances that are harmful to the packageable product. The silicon material may be used to release substances that are beneficial to the packageable product.
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Inventors:
Lee Tray, Gangnam
Application Number:
JP2008523448A
Publication Date:
January 29, 2009
Filing Date:
July 27, 2006
Export Citation:
Assignee:
Cymedica Limited
International Classes:
B65D65/38; B65D81/24; B65D81/26; C01B33/02
Domestic Patent References:
| JP2004506558A | 2004-03-04 | |||
| JP2003190784A | 2003-07-08 | |||
| JP2003523431A | 2003-08-05 |
Attorney, Agent or Firm:
Yoshio Kawaguchi
Makoto Ono
Chihiro Watanabe
Kenkyo Kanayama
Katsuma Osaki
Mitsuaki Tsubokura
Makoto Ono
Chihiro Watanabe
Kenkyo Kanayama
Katsuma Osaki
Mitsuaki Tsubokura