Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
締着装置
Document Type and Number:
Japanese Patent JP2009527655
Kind Code:
A
Abstract:
A mechanical fastening system having an engaging component and a receiving component. The receiving component has a first bond line, a second bond line, a bond zone, and a plurality of consecutive sweep regions. The second bond line is disposed adjacent to the first bond line such that a portion of the second bond line overlaps a portion of the first bond line. The bond zone circumscribes the first bond line and the second bond line. The plurality of consecutive sweep regions are disposed within the bond zone. At least one sweep region includes a portion of both the first bond line and the second bond line, and the remaining sweep regions include at least a portion of the first or the second bond lines. The receiving component has a bond ratio greater than or equal to about 1 and less than or equal to about 20.

Inventors:
Thomas, Alexander, Horn
Mark, James, Klein
Kazuhiko Masuda
Morimoto Takashi
Application Number:
JP2008554903A
Publication Date:
July 30, 2009
Filing Date:
February 23, 2007
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
THE PROCTER & GAMBLE COMPANY
International Classes:
D06H5/00; A44B18/00; D04H1/558
Domestic Patent References:
JPH11335960A1999-12-07
JP2006265782A2006-10-05
JP2003009912A2003-01-14
JP2002065740A2002-03-05
JP2003221772A2003-08-08
JP2003038213A2003-02-12
JPH11335960A1999-12-07
JP2006265782A2006-10-05
JP2003009912A2003-01-14
JP2002065740A2002-03-05
JP2003221772A2003-08-08
JP2003038213A2003-02-12
Attorney, Agent or Firm:
Kenji Yoshitake
Hiroyuki Nagai
Junpei Okada
Hirohito Katsunuma
Satoshi Nazuka