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Document Type and Number:
Japanese Patent JP2011502788
Kind Code:
Apparatuses and methods are provided for processing a surface of a substrate. The substrate may have a surface pattern that exhibits directionally and/or orientationally different reflectivities relative to radiation of a selected wavelength and polarization. The apparatus may include a radiation source that emits a photonic beam of the selected wavelength and polarization directed toward the surface at orientation angle and incidence angle selected to substantially minimize substrate surface reflectivity variations and/or minimize the maximum substrate surface reflectivity during scanning. Also provided are methods and apparatuses for selecting an optimal orientation and/or incidence angle for processing a surface of a substrate.

Andrew M Howriluk
Application Number:
Publication Date:
January 27, 2011
Filing Date:
November 03, 2008
Export Citation:
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International Classes:
B23K26/00; B23K26/08; H01L21/265; H01L21/268
Domestic Patent References:
Attorney, Agent or Firm:
Kenji Sugimura
Akito Okura
Atsushi Araki