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Title:
温度制御のための流体ゾーンを備えるワークピース支持体
Document Type and Number:
Japanese Patent JP2011503877
Kind Code:
A
Abstract:
A workpiece support is disclosed defining a workpiece-receiving surface. The workpiece support includes a plurality of fluid zones. A fluid, such as a gas, is fed to the fluid zones for contact with a workpiece on the workpiece support. The fluid can have selected thermoconductivity characteristics for controlling the temperature of the workpiece at particular locations. In accordance with the present disclosure, at least certain of the fluid zones are at different azimuthal positions. In this manner, the temperature of the workpiece can be adjusted not only in a radial direction but also in an angular direction.

Inventors:
Martin El. Zucker
Daniel Jay. Devine
Vladimir Nagarney
Jonathan Morne
Application Number:
JP2010533172A
Publication Date:
January 27, 2011
Filing Date:
October 31, 2008
Export Citation:
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Assignee:
Mattson Technology, Inc.
International Classes:
H01L21/683; B01F23/30; H01L21/205; H01L21/3065; H01L21/31
Domestic Patent References:
JPS6060060A1985-04-06
JPH1041378A1998-02-13
JP2006049468A2006-02-16
JP2002141332A2002-05-17
Attorney, Agent or Firm:
Toshio Yano
Toshiomi Yamazaki
Takuya Kuno
Hiroshi Sugimoto
Takahashi
Kimihiro Hoshi
Hiroyasu Ninomiya
Einzel Felix-Reinhard