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Patent Searching and Data


Title:
熱伝導性構造
Document Type and Number:
Japanese Patent JP2011509845
Kind Code:
A
Abstract:
A multi-layered honeycomb structure adapted to reduce and/or eliminate thermal deformation is disclosed herein. In some embodiments, walls of the honeycomb structure comprise a first layer, optionally, a second layer, and a core layer adjacent to the first layer or between the first and second layers. The first and second layers may be compositions of Inconel or other high strength materials. The core layer may be copper or another thermally conductive material. The core layer is adapted to transmit heat between a first region of a structure and a second region. In this manner, heat can be transferred from the heated region to an unheated region, thereby reducing the temperature difference between the regions and thus the amount of thermal deformation.

Inventors:
Straza George Sea. P.
Application Number:
JP2010542385A
Publication Date:
March 31, 2011
Filing Date:
January 09, 2009
Export Citation:
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Assignee:
Vertex Enterprises, Inc.
International Classes:
B32B3/12; B32B7/027; B32B15/01; F01D25/30; F02C7/00; F02K1/46; F02K1/82
Domestic Patent References:
JPH07139429A1995-05-30
JP2006239917A2006-09-14
JP2004522889A2004-07-29
JP2003034832A2003-02-07
JPH09507443A1997-07-29
JPS63172639A1988-07-16
JPH08501254A1996-02-13
Attorney, Agent or Firm:
Hatsushi Shimizu
Masao Haruna
Hirotaka Yamaguchi
Toshi Gobe
Ryuichi Inoue
Toshimitsu Sato
Koichi Niimi
Tomohiko Kobayashi
Shinichi Watanabe
Masato Ozeki
Yoshihiro Igarashi
Kazuya Kawamoto