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Patent Searching and Data


Title:
プロセスデータおよび生産量データを使用するプロセス制御
Document Type and Number:
Japanese Patent JP2011513993
Kind Code:
A
Abstract:
A method for monitoring a manufacturing process features acquiring metrology data for semiconductor wafers at the conclusion of a final process step for the manufacturing process (“Step a”). Data is acquired for a plurality of process variables for a first process step for manufacturing semiconductor wafers (“Step b”). A first mathematical model of the first process step is created based on the metrology data and the acquired data for the plurality of process variables for the first process step (“Step c”). Steps b and c are repeated for at least a second process step for manufacturing the semiconductor wafers (“Step d”). An nth mathematical model is created based on the metrology data and the data for the plurality of process variables for each of the n process steps ('Step e“). A top level mathematical model is created based on the metrology data and the models created by steps c, d and e (”Step f'). The top level mathematical model of Step f is based on those process variables that have a substantial effect on the metrology data.

Inventors:
Lawrence, Henderer
Phosphorus, quinine
Waldo, Svante, Bjane
Application Number:
JP2010549708A
Publication Date:
April 28, 2011
Filing Date:
February 20, 2009
Export Citation:
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Assignee:
MKS INSTRUMENTS,INC.
International Classes:
H01L21/02; G05B19/418
Domestic Patent References:
JP2006155557A2006-06-15
JP2008091591A2008-04-17
Foreign References:
US20050268197A12005-12-01
US20060212156A12006-09-21
WO2005054968A12005-06-16
US20050060103A12005-03-17
Attorney, Agent or Firm:
Mieko Kashihara
Goichi Takahashi
Masahito Shibata