Title:
ポリマーレリーフ構造体を作製する方法
Document Type and Number:
Japanese Patent JP2011516677
Kind Code:
A
Abstract:
The invention relates to a process for the preparation of a polymeric relief structure comprising the steps
a) coating a substrate with a coating composition comprising one or more radiation-sensitive ingredients,
b) locally treating the coated substrate with electromagnetic radiation having a periodic, non periodic or random radiation-intensity pattern, forming a latent image,
c) polymerizing and/or crosslinking the resulting coated substrate,
wherein the coating composition comprises a compound A comprising at least one radiation curable group and having a transition temperature between 30 °C and 120 °C and a photoinitiator. The invention also relates to polymeric relief structures having a high aspect ratio despite a very thin coated layer.
Inventors:
Hermann's Co
Tomatsu Ituro
Sievesma Linche Peter
Bastien Sen Cornelis Wilhelms Maria
Blower Dark Yang
Tomatsu Ituro
Sievesma Linche Peter
Bastien Sen Cornelis Wilhelms Maria
Blower Dark Yang
Application Number:
JP2011503422A
Publication Date:
May 26, 2011
Filing Date:
April 07, 2009
Export Citation:
Assignee:
STICHTING DUTCH POLYMER INSTITUTE
International Classes:
C08F2/44; C08F20/54
Domestic Patent References:
| JP2010501687A | 2010-01-21 | |||
| JPS63182322A | 1988-07-27 |
Attorney, Agent or Firm:
Hiroyoshi Aoki
Amada Masayuki
Toru Kanno
Amada Masayuki
Toru Kanno