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Title:
流体不浸透性が改善された複合パネル
Document Type and Number:
Japanese Patent JP2011519980
Kind Code:
A
Abstract:
A prepreg composite material that includes a fiber layer and a resin comprising a thermoset resin component, a curing agent and a fibrous micropulp. The micropulp component is an aramid fiber having a volume average length of from 0.01 to 100 micrometers. The prepreg is useful in composite panel construction for minimizing fluid permeation into the cured structure. This prepreg is particularly suitable for making honeycomb sandwich panels. Film adhesives, liquid and paste resins containing aramid fiber micropulp are also disclosed.

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Inventors:
Khan Sbotosh
Loken Halver Young
Application Number:
JP2011503189A
Publication Date:
July 14, 2011
Filing Date:
April 03, 2009
Export Citation:
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Assignee:
E.I.DU PONT DE NEMOURS AND COMPANY
International Classes:
C08J5/24; B29C65/48; B29C70/06; B32B3/12; B32B27/04; B29K105/12
Domestic Patent References:
JPS6060135A1985-04-06
JPS58117226A1983-07-12
JPH04112032A1992-04-14
JP2009525393A2009-07-09
JP2004503740A2004-02-05
JPS6038134A1985-02-27
JP2000238154A2000-09-05
JP2005509760A2005-04-14
Foreign References:
WO2007092295A12007-08-16
Attorney, Agent or Firm:
Koichi Tsujii
Sadao Kumakura
Nobuo Ogawa
Atsushi Hakoda
Kenji Asai
Kazuo Yamazaki



 
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