Title:
テープ設置装置及びラミネートの構成のための方法
Document Type and Number:
Japanese Patent JP2011524291
Kind Code:
A
Abstract:
The present invention creates a tape laying device as well as a method for the construction of a laminate by means of a tape laying device, in particular in the field of aviation and aerospace. The tape laying device comprises a laying arrangement for laying tape for the construction of a laminate and a stimulation arrangement by means of which the tape which has to be laid can be stimulated directly and evenly over the thickness thereof so as to be heated. The idea the present invention is based on consists in that instead of the stimulation at the surface of the tape which has to be laid which is known to the Applicant a direct and evenly stimulation of the tape which has to be laid takes place, that means, a stimulation which acts substantially direct and evenly over the thickness of the tape which has to be laid on the tapes components. The heating achieved by this is much faster than by means of convection according to the known approach. Therefore, the desired tackiness of the tape which has to be laid can be achieved at the desired high laying velocity.
Inventors:
Length felt
Application Number:
JP2011505443A
Publication Date:
September 01, 2011
Filing Date:
March 12, 2009
Export Citation:
Assignee:
Airbus Opera Zion Gesellschaft Mitt Beschlenktel Haftung
International Classes:
B64F5/00
Foreign References:
| US6814822B2 | 2004-11-09 | |||
| US4569716A | 1986-02-11 | |||
| US5571368A | 1996-11-05 | |||
| US5228944A | 1993-07-20 | |||
| WO2007091931A1 | 2007-08-16 | |||
| US5177340A | 1993-01-05 | |||
| EP0846551A1 | 1998-06-10 | |||
| US20110108188A1 | 2011-05-12 |
Attorney, Agent or Firm:
Noboru Fujimoto
Seiichi Yakumaru
Seiichi Yakumaru