Title:
均一蒸着のための装置及び方法
Document Type and Number:
Japanese Patent JP2011524471
Kind Code:
A
Abstract:
Embodiments of the present invention generally relate to an apparatus and method for uniform sputter depositing of materials into the bottom and sidewalls of high aspect ratio features on a substrate. In one embodiment, a sputter deposition system includes a collimator that has apertures having aspect ratios that decrease from a central region of the collimator to a peripheral region of the collimator. In one embodiment, the collimator is coupled to a grounded shield via a bracket member that includes a combination of internally and externally threaded fasteners. In another embodiment, the collimator is integrally attached to a grounded shield. In one embodiment, a method of sputter depositing material includes pulsing the bias on the substrate support between high and low values.
Inventors:
Khao Yong
Ewart Morris E
Tan Shan Min
Mirror Keith A
Ruben Daniel Shee
Kerker Yumesh M
Gunza-Gin
Subra Mani Anan Kay
Ewart Morris E
Tan Shan Min
Mirror Keith A
Ruben Daniel Shee
Kerker Yumesh M
Gunza-Gin
Subra Mani Anan Kay
Application Number:
JP2011514713A
Publication Date:
September 01, 2011
Filing Date:
June 11, 2009
Export Citation:
Assignee:
APPLIED MATERIALS,INCORPORATED
International Classes:
C23C14/34; H01L21/285
Domestic Patent References:
| JP2006500472A | 2006-01-05 | |||
| JP2005514777A | 2005-05-19 | |||
| JP2007273490A | 2007-10-18 | |||
| JPH09500690A | 1997-01-21 |
Attorney, Agent or Firm:
Koichi Tsujii
Sadao Kumakura
Fumiaki Otsuka
Takaki Nishijima
Hiroyuki Suda
Hiroshi Uesugi
Sadao Kumakura
Fumiaki Otsuka
Takaki Nishijima
Hiroyuki Suda
Hiroshi Uesugi