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Title:
基板中にホール又は凹部又はくぼみを発生させる方法、該方法を実行するためのデバイス及び該デバイスで用いる高周波高電圧源
Document Type and Number:
Japanese Patent JP2012519090
Kind Code:
A
Abstract:
The present invention relates to a method of generating a hole or recess or well in an electrically insulating or semiconducting substrate, and to a hole or recess or well in a substrate generated by this method. The invention also relates to an array of holes or recesses or wells in a substrate generated by the method. The invention also relates to a device for performing the method according to the present invention.

Inventors:
Schmidt, Christian
Lindtell, Ditman
Application Number:
JP2011551445A
Publication Date:
August 23, 2012
Filing Date:
March 01, 2010
Export Citation:
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Assignee:
Pico Drill S
International Classes:
B28D5/00; B23K26/00; B23K26/073; B23K26/14; B23K26/38; B26F1/28; H05K3/00
Domestic Patent References:
JPH05208323A1993-08-20
JPS63267125A1988-11-04
JP2006263891A2006-10-05
JP2007000328A2007-01-11
JP2004200119A2004-07-15
JP2002011585A2002-01-15
JP2000233287A2000-08-29
JPH05208323A1993-08-20
JPS63267125A1988-11-04
JP2006263891A2006-10-05
JP2007000328A2007-01-11
JP2004200119A2004-07-15
JP2002011585A2002-01-15
JP2000233287A2000-08-29
Foreign References:
WO2005097439A22005-10-20
WO2005097439A22005-10-20
Attorney, Agent or Firm:
Tadahiko Ito
Shinsuke Onuki
Tadashige Ito